Fly BVLOS Technology has unveiled plans to embark on a groundbreaking initiative that marks a technological milestone for Türkiye. The company will begin manufacturing of 30-layer domestic chips at its cutting-edge facility in Ankara.
The initiative involves the transfer of advanced technology from Taiwan and the construction of a high-tech production line, with mass production slated to commence in the coming months.
Global Collaboration and Investment
Supported by millions of dollars in foreign investment, the project has brought together a skilled team of Turkish engineers and Taiwanese experts working in collaboration. This partnership underscores Türkiye’s commitment to fostering innovation and technological self-reliance.
Pioneering the Fastest Mission Computers
As part of the project, Fly BVLOS Technology will manufacture a range of products, including multilayer chips, network devices, servers, and laptops, as well as multilayer PCBs and motherboards.
The company’s domestically-produced chips will serve as the core component of its mission computers, which are projected to outpace current global standards in speed and sophistication.
Strategic Advancement for Defense Applications
Fly BVLOS Technology’s mission computers, equipped with indigenous chips, are expected to play a crucial role in the defense industry, particularly in unmanned aerial vehicles (UAVs) and other critical systems.
This development signifies a transformative step for Türkiye’s industrial and technological sectors, with broader implications for the global defense and technology landscape. The company is anticipated to provide further updates in the coming days.
The project’s rollout will occur in three strategic phases:
Phase 1 (2025): Establishment of an SMT and assembly line with an annual capacity of 144,000 units for network hardware and AI servers. A PCB laboratory will also be developed in collaboration with Ostim Technical University to train specialized human resources for PCB production. Phase 2 (2026): Construction of a domestic PCB production facility and initiation of local motherboard manufacturing. Assembly line capacity will be doubled to meet growing demand. Phase 3 (2027): Introduction of 3-nanometer technology with a laboratory capable of producing 5,000 chips monthly, marking a significant leap in advanced semiconductor manufacturing.This ambitious project represents a historic leap for Türkiye’s defense, technology, and industrial ecosystems. By establishing local chip production capabilities and advancing cutting-edge technology, Fly BVLOS Technology is positioning Türkiye as a key player on the global stage.
Ahmet Işıktekiner - (Correspondent - Muhabir)
Mehmet Burak Tekeş - (Cameraman)